Samples of Our Chrome Plating Services and ASTM, MIL C, AMS

A typical sequence of electroless nickel and hard chrome build up involves:

1. Surface preparation (Smooth / Clean / Dry)
2. Nickel Coating application
3. Electroless and Hard Chrome Curing

Important considerations in the selection of the coating or plating include

Purpose
Use
Cost
Expected useful life
Environmental exposure.

Special Plating specifications

Chromplate certifies its work for
Aerospace Material Specifications AMS 2404 do not specify phosphorus content even though today that deposits with different phosphorus contents have different physical deposit properties.

Military Specifications MIL C-26074 E Electroless Nickel
Military Specifications MIL QQ-C-320 updated to AMS 2460 Chrome Plating
ASTM B733 Electroless Nickel
AMS 2404 Electroless Nickel

Electroless plating is the chemical deposition of a metal coating on a substrate by immersion in the appropriate plating solution. Electricity is not involved in ElectroLess plating process.

Uniform deposits can then be easily obtained which possess unique mechanical, chemical or magnetic properties. The electroless process can be applied to properly treated metallic & non-metallic object such as plastic and glass.

Flash Hard Chrome
Flash Hard Chrome - Aluminum Piston	Flash Hard Chrome - Steel Bearing

Flash Hard Chrome - Brass Dental Hard Piece

Flash Hard Chrome - Tapered Shaft

Flash Hard Chrome - Steel Racing Exhaust Valve

 

Hard Chrome Build Up
Hard Chrome Build-Up - Steel Plunger		Hard Chrome Build-Up - Fastener - Finish Ground After Hard Chrome

 

Electroless Nickel Plating
Electroless Nickel - Aluminum Connector	Electroless Nickel Plating - Steel Sleeve	Electroless Nickel Plating - Steel Body
Electroless Nickel Plating - Steel Shell	Electroless Nickel Plating - Aluminum Connector

 

We always ensure adequate replenishment of chemical components from the bulk solution to the substrate surface the microstructure of an electroless nickel-phosphorus deposit is strongly dependent upon the alloy content of the deposit. Phosphorus levels can vary from one to 14 pct by weight with most commercial baths, ranging from three to 12 pct by weight. At low phosphorus levels, (< seven pct by weight) the electroless nickel deposit is microcrystalline, consisting of many small grains, approximately two to six nm in size. As the amount of alloyed phosphorus increases, the microstructure changes to a mixture of amorphous and microcrystalline phases and finally to a totally amorphous phase (>10 pct by weight).

We carefully control the melting point range of electroless nickel deposits also varies with phosphorus content, decreasing with increasing phosphorus levels. Electroless nickel does not have a melting point, but rather a melting range. Alloying elements such as phosphorus as well as the presence of amorphous phases increase the electrical resistivity of the deposit.

We Consider Magnetic properties. One of the most important applications of electroless nickel films is in the data storage industry. This is due primarily to its corrosion protection, hardness, polishability and magnetic characteristics. At high phosphorus levels, electroless nickel deposits are non-magnetic. As the phosphorus content decreases, electroless nickel deposits show increasing magnetization.

We check the Solderability/Weldability. An important aspect of electroless nickel to the electronics industry is its solderability. All electroless nickel deposits are solderable provided the soldering conditions are matched to the condition of the particular electroless nickel deposit. Lower-phosphorus electroless nickel is more easily solderable immediately after plating than higher-phosphorus electroless nickel. However, this advantage disappears after 12 - 24 hrs. At this point, the ease of solderability depends upon the characteristics of the passive layer that forms on the surface of the electroless nickel deposit. Those deposits plated from baths containing heavy metal and sulfur-bearing brighteners and stabilizers, low- and mid-phosphorus electroless nickel systems, form a thicker tenacious passive layer than those that do not, such as most high-phosphorus electroless nickel systems. High-phosphorus electroless nickel systems tend to be more solderable in aged deposits.

Other important factors influencing the solderability of electroless nickel deposits include residual contamination left on the surface after plating and storage conditions after drying. Surface contamination and exposure to environments containing sulfur dioxide, chlorine, high humidity and high ambient temperatures will detrimentally affect solderability. We check that parts be thoroughly rinsed in clean DI water, dried and stored in a cool, dry atmosphere, preferably nitrogen.